Electronic Failure Analysis Handbook: Techniques and Applications for Electronic and Electrical Packages, Components, and Assemblies

by: Perry L. Martin


Abstract: Still digging for the latest developments and techniques in electronic failure analysis? The leading-edge methods for slashing product failure rates are all right here in this complete, comprehensive source. You’ll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance. Absolutely essential to anyone concerned with electronic product development and testing, the Handbook gives you ready-to-use, insider information on state-of-the-art EFA techniques; the how’s and why’s of electronic failures; failure prediction; warranty cost control; liability-costs and other issues.
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Book Details

Title: Electronic Failure Analysis Handbook: Techniques and Applications for Electronic and Electrical Packages, Components, and Assemblies

Publisher: McGRAW-HILL: New York, San Francisco, Washington, D.C., Auckland, Bogotá, Caracas, Lisbon, London, Madrid, Mexico City, Milan, Montreal, New Delhi, San Juan, Singapore, Sydney, Tokyo, Toronto

Copyright / Pub. Date: 1999 The McGraw-Hill Companies, Inc

ISBN: 9780070410442

Authors:

Perry L. Martin is the author of this McGraw-Hill Professional publication.

Description: Still digging for the latest developments and techniques in electronic failure analysis? The leading-edge methods for slashing product failure rates are all right here in this complete, comprehensive source. You’ll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance. Absolutely essential to anyone concerned with electronic product development and testing, the Handbook gives you ready-to-use, insider information on state-of-the-art EFA techniques; the how’s and why’s of electronic failures; failure prediction; warranty cost control; liability-costs and other issues.