Microvias: For Low Cost, High Density Interconnects

by: John H. Lau


Abstract: The first-ever book on microvias, the new high-density interconnect technology changing the nature of printed circuit boards–and driving the mobile electronic revolution. A must for electronics and mechanical engineers, this intensive introduction covers microvia technology expertly surveys all major techniques: mechanical NC drilling, laser drilling, photo-defined, chemical etching, and conductive ink formation. Features a detailed survey of the work of leading companies–and their products–from around the globe.
Full details

Book Details

Title: Microvias: For Low Cost, High Density Interconnects

Publisher: McGraw-Hill: New York, Chicago, San Francisco, Lisbon, London, Madrid, Mexico City, Milan, New Delhi, San Juan, Seoul, Singapore, Sydney, Toronto

Copyright / Pub. Date: 2001 The McGraw-Hill Companies, Inc.

ISBN: 9780071363273

Authors:

John H. Lau is the author of this McGraw-Hill Professional publication.

Description: The first-ever book on microvias, the new high-density interconnect technology changing the nature of printed circuit boards–and driving the mobile electronic revolution. A must for electronics and mechanical engineers, this intensive introduction covers microvia technology expertly surveys all major techniques: mechanical NC drilling, laser drilling, photo-defined, chemical etching, and conductive ink formation. Features a detailed survey of the work of leading companies–and their products–from around the globe.