OPTIONS IN HIGH-DENSITY PART CLEANING


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OPTIONS IN HIGH-DENSITY PART CLEANING
1010608OPTIONS IN HIGH-DENSITY PART CLEANINGSteve Randolph and John SandersSpeedline ACCEL
<emphasis role="italic"><emphasis role="bold">INTRODUCTION</emphasis></emphasis> While high-density packages such as flip chip (FC) and ball grid array (BGA) devices deliver substantial input-output (I/O) resources, their close dimensions intr…
Citation
Ken Gilleo; Jan Vardaman: Area Array Packaging Handbook: Manufacturing and Assembly. OPTIONS IN HIGH-DENSITY PART CLEANING, Chapter (McGraw-Hill Professional, 2002), AccessEngineering Export