AREA ARRAY SOLDER SPHERES, PASTES, AND FLUXES


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AREA ARRAY SOLDER SPHERES, PASTES, AND FLUXES
1010608AREA ARRAY SOLDER SPHERES, PASTES, AND FLUXESGerard MinogueAlpha-Fry Technology
<emphasis role="italic"><emphasis role="bold">INTRODUCTION</emphasis></emphasis> Ball grid array (BGA) technology is currently perhaps the most innovative practical means of addressing issues of package and board interconnect problems as …
Citation
Ken Gilleo; Jan Vardaman: Area Array Packaging Handbook: Manufacturing and Assembly. AREA ARRAY SOLDER SPHERES, PASTES, AND FLUXES, Chapter (McGraw-Hill Professional, 2002), AccessEngineering Export