NEXT-GENERATION FLIP CHIP MATERIALS AND PROCESSING


Please sign in to view the rest of this entry.

NEXT-GENERATION FLIP CHIP MATERIALS AND PROCESSING
1010608NEXT-GENERATION FLIP CHIP MATERIALS AND PROCESSINGDaniel F. Baldwin, Ph.D.
<emphasis role="italic"><emphasis role="bold">INTRODUCTION</emphasis></emphasis> One of the significant developments to improve cost, reliability, and productivity in the electronic packaging industry has been flip chip (FC) technology. This technology has been enhanced further to enable direct assembly to printed wiring boards (PWB…
Citation
Ken Gilleo; Jan Vardaman: Area Array Packaging Handbook: Manufacturing and Assembly. NEXT-GENERATION FLIP CHIP MATERIALS AND PROCESSING, Chapter (McGraw-Hill Professional, 2002), AccessEngineering Export