FLIP CHIP ASSEMBLY AND UNDERFILLING


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FLIP CHIP ASSEMBLY AND UNDERFILLING
1010608FLIP CHIP ASSEMBLY AND UNDERFILLINGR. Wayne JohnsonAuburn University
<emphasis role="italic"><emphasis role="bold">INTRODUCTION</emphasis></emphasis> IBM first introduced flip chip (FC) technology in 1964 in the solid logic technology (SLT) hybrid modules in the System 360 mainframe.
Citation
Ken Gilleo; Jan Vardaman: Area Array Packaging Handbook: Manufacturing and Assembly. FLIP CHIP ASSEMBLY AND UNDERFILLING, Chapter (McGraw-Hill Professional, 2002), AccessEngineering Export