CRITERIA FOR PLACEMENT AND PROCESSING OF ADVANCED PACKAGES


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CRITERIA FOR PLACEMENT AND PROCESSING OF ADVANCED PACKAGES
1010608CRITERIA FOR PLACEMENT AND PROCESSING OF ADVANCED PACKAGESG√ľnter SchiebelSiemens Production and Logistics Systems AG
<emphasis role="italic"><emphasis role="bold">INTRODUCTION</emphasis></emphasis> Advanced packages such as the ball grid array (BGA), chip scale package (CSP), and flip chip (FC) to a cont…
Citation
Ken Gilleo; Jan Vardaman: Area Array Packaging Handbook: Manufacturing and Assembly. CRITERIA FOR PLACEMENT AND PROCESSING OF ADVANCED PACKAGES, Chapter (McGraw-Hill Professional, 2002), AccessEngineering Export