THE FUTURE OF ELECTRONIC PACKAGING


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THE FUTURE OF ELECTRONIC PACKAGING
1010608THE FUTURE OF ELECTRONIC PACKAGINGSteve AndersonSilicon Bandwidth, Inc.
<emphasis role="italic"><emphasis role="bold">THE CONVERGENCE OF MARKETS: COMPUTING, COMMUNICATIONS, CONSUMER</emphasis></emphasis> It is clear that today‚Äôs world is focused on miniaturization, with the result that the convergence phenomenon is increasingly…
Citation
Ken Gilleo; Jan Vardaman: Area Array Packaging Handbook: Manufacturing and Assembly. THE FUTURE OF ELECTRONIC PACKAGING, Chapter (McGraw-Hill Professional, 2002), AccessEngineering Export