Source

Electronic Materials and Processes Handbook, Third Edition

Electronic Materials and Processes Handbook, Third Edition

Page Contents

Introduction
Solder Materials
Solder Paste
Soldering Methodology
Solderability 1
Cleaning
Fine-Pitch Application
Soldering-Related Issues 2
Solder-Joint Appearance and Microstructure
Solder-Joint Integrity
Lead-Free Solders

Solder Technologies for Electronic Packaging and Assembly

Solder Technologies for Electronic Packaging and Assembly

Jennie S. Hwang H-Technologies Group, Inc. Cleveland, Ohio 1010604Solder Technologies for Electronic Packaging and Assembly

<emphasis role="bold">Introduction</emphasis>

<emphasis role="bold">Scope</emphasis> …

Citation

Charles A. Harper: Electronic Materials and Processes Handbook, Third Edition. Solder Technologies for Electronic Packaging and Assembly, Chapter (McGraw-Hill Professional, 2004 1994 1970), AccessEngineering Export