ENVIRONMENTALLY BENIGN MOLDING COMPOUNDS FOR IC PACKAGES


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ENVIRONMENTALLY BENIGN MOLDING COMPOUNDS FOR IC PACKAGES
10306001010608ENVIRONMENTALLY BENIGN MOLDING COMPOUNDS FOR IC PACKAGES
<emphasis role="italic"><emphasis role="bold">INTRODUCTION</emphasis></emphasis> As discussed in Chap. 1, the Waste Electrical and Electronic Equipment and Reduction of Hazardous Substances directives require electronic products to be halogen-free and lead-free due to increasing awareness …
Citation
John H. Lau; C.P. Wong; Ning-Cheng Lee; Shi-Wei Ricky Lee: Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials. ENVIRONMENTALLY BENIGN MOLDING COMPOUNDS FOR IC PACKAGES, Chapter (McGraw-Hill Professional, 2003), AccessEngineering Export