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Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials

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INTRODUCTION
ENVIRONMENTALLY BENIGN DIE ATTACH FILMS
ENVIRONMENTALLY BENIGN In-Sn DIE ATTACH BONDING TECHNIQUE
In-Sn PHASE DIAGRAM
ACKNOWLEDGMENTS

ENVIRONMENTALLY BENIGN DIE ATTACH FILMS FOR IC PACKAGING

10306001010608ENVIRONMENTALLY BENIGN DIE ATTACH FILMS FOR IC PACKAGING

<emphasis role="italic"><emphasis role="bold">INTRODUCTION</emphasis></emphasis> As discussed in Chaps. 1 and 6, environmentally benign electronics manufacturing, especially in Japan and …

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John H. Lau; C.P. Wong; Ning-Cheng Lee; Shi-Wei Ricky Lee: Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials. ENVIRONMENTALLY BENIGN DIE ATTACH FILMS FOR IC PACKAGING, Chapter (McGraw-Hill Professional, 2003), AccessEngineering Export

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ENVIRONMENTALLY BENIGN DIE ATTACH FILMS FOR IC PACKAGING

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