Fundamentals of Microsystems Packaging
by: Rao R. Tummala
Abstract: A rigorous and thorough introduction to electronic packaging technologies. Each chapter covers a single major packaging technology illustrated with schematics and diagrams. Aspects of electrical, mechanical, chemical, and materials packaging are identified in each chapter
Full details
Table of Contents
- A. PREFACE
- B. DEDICATION
- C. PREFACE
- 1. INTRODUCTION TO MICROSYSTEMS PACKAGING
- 2. THE ROLE OF PACKAGING IN MICROELECTRONICS
- 3. THE ROLE OF PACKAGING IN MICROSYSTEMS
- 4. FUNDAMENTALS OF ELECTRICAL PACKAGE DESIGN
- 5. FUNDAMENTALS OF DESIGN FOR RELIABILITY
- 6. FUNDAMENTALS OF THERMAL MANAGEMENT
- 7. FUNDAMENTALS OF SINGLE CHIP PACKAGING
- 8. FUNDAMENTALS OF MULTICHIP PACKAGING
- 9. FUNDAMENTALS OF IC ASSEMBLY
- 10. FUNDAMENTALS OF WAFER-LEVEL PACKAGING
- 11. FUNDAMENTALS OF PASSIVES: DISCRETE, INTEGRATED, AND EMBEDDED
- 12. FUNDAMENTALS OF OPTOELECTRONICS
- 13. FUNDAMENTALS OF RF PACKAGING
- 14. FUNDAMENTALS OF MICROELECTROMECHANICAL SYSTEMS
- 15. FUNDAMENTALS OF SEALING AND ENCAPSULATION
- 16. FUNDAMENTALS OF SYSTEM-LEVEL PWB TECHNOLOGIES
- 17. FUNDAMENTALS OF BOARD ASSEMBLY
- 18. FUNDAMENTALS OF PACKAGING MATERIALS AND PROCESSES
- 19. FUNDAMENTALS OF ELECTRICAL TESTING
- 20. FUNDAMENTALS OF PACKAGE MANUFACTURING
- 21. FUNDAMENTALS OF MICROSYSTEMS DESIGN FOR ENVIRONMENT
- 22. FUNDAMENTALS OF MICROSYSTEMS RELIABILITY
- A. GLOSSARY
- B. APPENDICES
- C. ABOUT THE AUTHOR
Tools & Media
Expanded Table of Contents
- A. PREFACE
- B. DEDICATION
- C. PREFACE
- 1. INTRODUCTION TO MICROSYSTEMS PACKAGING
- CHAPTER OBJECTIVES
- CHAPTER INTRODUCTION
- WHAT ARE MICROSYSTEMS?
- MICROSYSTEM TECHNOLOGIES
- WHAT IS MICROSYSTEMS PACKAGING (MSP)?
- WHY IS MICROSYSTEMS PACKAGING IMPORTANT?
- SYSTEM-LEVEL MICROSYSTEMS TECHNOLOGIES
- WHAT IS EXPECTED OF YOU AS A MICROSYSTEMS ENGINEER?
- SUMMARY AND FUTURE TRENDS
- WHO INVENTED MICROSYSTEMS AND PACKAGING TECHNOLOGIES? (Excerpted and adapted with permission from IEEE Spectrum, June 2000)
- HOMEWORK PROBLEMS
- ACKNOWLEDGMENT
- 2. THE ROLE OF PACKAGING IN MICROELECTRONICS
- 3. THE ROLE OF PACKAGING IN MICROSYSTEMS
- CHAPTER OBJECTIVES
- CHAPTER INTRODUCTION
- WHAT IS AN ELECTRONIC PRODUCT?
- ANATOMY OF A MICROSYSTEM
- COMPUTERS AND THE INTERNET
- WHAT IS THE ROLE OF PACKAGING IN THE COMPUTER INDUSTRY?
- WHAT IS THE ROLE OF PACKAGING IN THE TELECOMMUNICATION INDUSTRY
- WHAT IS THE ROLE OF PACKAGING IN AUTOMOTIVE SYSTEMS
- WHAT IS THE ROLE OF PACKAGING IN MEDICAL ELECTRONICS
- WHAT IS THE ROLE OF PACKAGING IN CONSUMER ELECTRONICS
- WHAT IS THE ROLE OF PACKAGING IN MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) PRODUCTS
- SUMMARY AND FUTURE TRENDS
- HOMEWORK PROBLEMS
- 4. FUNDAMENTALS OF ELECTRICAL PACKAGE DESIGN
- 5. FUNDAMENTALS OF DESIGN FOR RELIABILITY
- 6. FUNDAMENTALS OF THERMAL MANAGEMENT
- 7. FUNDAMENTALS OF SINGLE CHIP PACKAGING
- 8. FUNDAMENTALS OF MULTICHIP PACKAGING
- CHAPTER OBJECTIVES
- CHAPTER INTRODUCTION
- WHAT ARE MULTICHIP MODULES?
- MULTICHIP MODULE FUNCTIONALITY
- MULTICHIP MODULE ADVANTAGES
- MULTICHIP MODULES AT THE SYSTEM LEVEL
- TYPES OF MULTICHIP MODULE SUBSTRATES
- MULTICHIP MODULE DESIGN
- MULTICHIP MODULE TECHNOLOGY COMPARISONS
- ALTERNATIVES TO MULTICHIP MODULES
- SUMMARY AND FUTURE TRENDS
- HOMEWORK PROBLEMS
- 9. FUNDAMENTALS OF IC ASSEMBLY
- 10. FUNDAMENTALS OF WAFER-LEVEL PACKAGING
- 11. FUNDAMENTALS OF PASSIVES: DISCRETE, INTEGRATED, AND EMBEDDED
- CHAPTER OBJECTIVES
- CHAPTER INTRODUCTION
- WHAT ARE PASSIVE COMPONENTS?
- ROLE OF PASSIVE COMPONENTS IN ELECTRONIC PRODUCTS
- FUNDAMENTALS OF PASSIVE COMPONENTS
- PHYSICAL REPRESENTATIONS OF PASSIVE COMPONENTS
- DISCRETE PASSIVES
- INTEGRATED PASSIVES
- EMBEDDED (INTEGRAL) PASSIVES
- SUMMARY AND FUTURE TRENDS
- HOMEWORK PROBLEMS
- ACKNOWLEDGMENT
- 12. FUNDAMENTALS OF OPTOELECTRONICS
- 13. FUNDAMENTALS OF RF PACKAGING
- 14. FUNDAMENTALS OF MICROELECTROMECHANICAL SYSTEMS
- 15. FUNDAMENTALS OF SEALING AND ENCAPSULATION
- 16. FUNDAMENTALS OF SYSTEM-LEVEL PWB TECHNOLOGIES
- CHAPTER OBJECTIVES
- CHAPTER INTRODUCTION
- WHAT IS A SYSTEM-LEVEL PRINTED WIRING BOARD?
- TYPES OFPRINTED WIRING BOARDS
- ANATOMY OFA PRINTED WIRING BOARD
- FUNDAMENTALS OFPRINTED WIRING BOARD
- CAD TOOLS FOR PRINTED WIRING BOARD DESIGN
- PRINTED WIRING BOARD MATERIALS
- STANDARD PRINTED WIRING BOARD FABRICATION
- LIMITATIONS IN STANDARD PRINTED WIRING BOARD PROCESS
- MICROVIA BOARDS
- PRINTED WIRING BOARD MARKET
- SUMMARY AND FUTURE TRENDS
- HOMEWORK PROBLEMS
- ACKNOWLEDGMENT
- 17. FUNDAMENTALS OF BOARD ASSEMBLY
- 18. FUNDAMENTALS OF PACKAGING MATERIALS AND PROCESSES
- 19. FUNDAMENTALS OF ELECTRICAL TESTING
- 20. FUNDAMENTALS OF PACKAGE MANUFACTURING
- 21. FUNDAMENTALS OF MICROSYSTEMS DESIGN FOR ENVIRONMENT
- 22. FUNDAMENTALS OF MICROSYSTEMS RELIABILITY
- CHAPTER OBJECTIVES
- CHAPTER INTRODUCTION
- WHAT IS THERMOMECHANICAL RELIABILITY?
- FUNDAMENTALS OF THERMOMECHANICAL RELIABILITY
- WHY IS RELIABILITY IMPORTANT?
- FAILURE MODES AND MECHANISMS
- RELIABILITY QUALIFICATIONS
- THERMOMECHANICAL FAILURE ANALYSIS
- EXPERIMENTAL METHODS AND TOOLS FOR RELIABILITY ANALYSIS
- INTEGRATED VIRTUAL RELIABILITY PREDICTION
- SUMMARY AND FUTURE TRENDS
- HOMEWORK PROBLEMS
- SUGGESTED READING
- ACKNOWLEDGMENT
- A. GLOSSARY
- B. APPENDICES
- C. ABOUT THE AUTHOR
Book Details
Title: Fundamentals of Microsystems Packaging
Publisher: McGRAW-HILL: New York, Chicago, San Francisco, Lisbon, London, Madrid, Mexico City, Milan, New Delhi, San Juan, Seoul, Singapore, Sydney, Toronto
Copyright / Pub. Date: 2001 The McGraw-Hill Companies, Inc
ISBN: 9780071371698
Authors:
Rao R. Tummala is the author of this McGraw-Hill Professional publication.
Description: A rigorous and thorough introduction to electronic packaging technologies. Each chapter covers a single major packaging technology illustrated with schematics and diagrams. Aspects of electrical, mechanical, chemical, and materials packaging are identified in each chapter
