Printed Circuits Handbook, Sixth Edition
There is a newer edition of this item.
Printed Circuits Handbook, Seventh Edition
by: Clyde F. Coombs, Jr.
Abstract: The printed circuit is the basic building block of the electronics hardware industry. It connects virtually all the components used, and affects every employee associated with the product, including design, fabrication, assembly, sourcing, quality, and reliability. There are still very few readily available courses that deal with printed circuits, and, therefore, this handbook remains a major source of information on the subject. Written by a global team of experts from both industry and academia, this new edition of the handbook will deal with both the increasing pressures of High Density Interconnect and the huge government-mandated changes related to lead-free manufacturing.
Full details
Table of Contents
- A. ABOUT THE EDITOR
- B. LIST OF CONTRIBUTORS
- C. PREFACE
- 1. LEGISLATION AND IMPACT ON PRINTED CIRCUITS
- 2. ELECTRONIC PACKAGING AND HIGH-DENSITY INTERCONNECTIVITY
- 3. SEMICONDUCTOR PACKAGING TECHNOLOGY
- 4. ADVANCED COMPONENT PACKAGING
- 5. TYPES OF PRINTED WIRING BOARDS
- 6. INTRODUCTION TO BASE MATERIALS
- 7. BASE MATERIAL COMPONENTS
- 8. PROPERTIES OF BASE MATERIALS
- 9. BASE MATERIALS PERFORMANCE ISSUES
- 10. THE IMPACT OF LEAD-FREE ASSEMBLY ON BASE MATERIALS
- 11. SELECTING BASE MATERIALS FOR LEAD-FREE ASSEMBLY APPLICATIONS
- 12. LAMINATE QUALIFICATION AND TESTING
- 13. PHYSICAL CHARACTERISTICS OF THE PCB
- 14. THE PCB DESIGN PROCESS
- 15. ELECTRICAL AND MECHANICAL DESIGN PARAMETERS
- 16. CURRENT CARRYING CAPACITY IN PRINTED CIRCUITS
- 17. PCB DESIGN FOR THERMAL PERFORMANCE
- 18. INFORMATION FORMATING AND EXCHANGE
- 19. PLANNING FOR DESIGN, FABRICATION, AND ASSEMBLY
- 20. MANUFACTURING INFORMATION, DOCUMENTATION, AND TRANSFER INCLUDING CAM TOOLING FOR FAB AND ASSEMBLY
- 21. EMBEDDED COMPONENTS
- 22. INTRODUCTION TO HIGH-DENSITY INTERCONNECTION (HDI) TECHNOLOGY
- 23. ADVANCED HIGH-DENSITY INTERCONNECTION (HDI) TECHNOLOGIES
- 24. DRILLING PROCESSES
- 25. PRECISION INTERCONNECT DRILLING
- 26. IMAGING
- 27. MULTILAYER MATERIALS AND PROCESSING
- 28. PREPARING BOARDS FOR PLATING
- 29. ELECTROPLATING
- 30. DIRECT PLATING
- 31. PWB MANUFACTURE USING FULLY ELECTROLESS COPPER
- 32. PRINTED CIRCUIT BOARD SURFACE FINISHES
- 33. SOLDER MASK
- 34. ETCHING PROCESS AND TECHNOLOGIES
- 35. MACHINING AND ROUTING
- 36. BARE BOARD TEST OBJECTIVES AND DEFINITIONS
- 37. BARE BOARD TEST METHODS
- 38. BARE BOARD TEST EQUIPMENT
- 39. HDI BARE BOARD SPECIAL TESTING METHODS
- 40. ASSEMBLY PROCESSES
- 41. CONFORMAL COATING
- 42. SOLDERABILITY: INCOMING INSPECTION AND WETTING BALANCE TECHNIQUE
- 43. FLUXES AND CLEANING
- 44. SOLDERING FUNDAMENTALS
- 45. SOLDERING MATERIALS AND METALLURGY
- 46. SOLDER FLUXES
- 47. SOLDERING TECHNIQUES
- 48. SOLDERING REPAIR AND REWORK
- 49. PRESS-FIT INTERCONNECTION
- 50. LAND GRID ARRAY INTERCONNECT
- 51. ACCEPTABILITY AND QUALITY OF FABRICATED BOARDS
- 52. ACCEPTABILITY OF PRINTED CIRCUIT BOARD ASSEMBLIES
- 53. ASSSEMBLY INSPECTION
- 54. DESIGN FOR TESTING
- 55. LOADED BOARD TESTING
- 56. CONDUCTIVE ANODIC FILAMENT FORMATION
- 57. RELIABILITY OF PRINTED CIRCUIT ASSEMBLIES
- 58. COMPONENT-TO-PWB RELIABILITY—THE IMPACT OF DESIGN VARIABLES AND LEAD FREE
- 59. COMPONENT-TO-PWB RELIABILITY: ESTIMATING SOLDER JOINT RELIABILITY AND THE IMPACT OF LEAD-FREE SOLDERS
- 60. PROCESS WASTE MINIMIZATION AND TREATMENT
- 61. FLEXIBLE CIRCUIT APPLICATIONS AND MATERIALS
- 62. DESIGN OF FLEXIBLE CIRCUITS
- 63. MANUFACTURING OF FLEXIBLE CIRCUITS
- 64. TERMINATION OF FLEXIBLE CIRCUITS
- 65. MULTILAYER FLEX AND RIGID/FLEX
- 66. SPECIAL CONSTRUCTIONS OF FLEXIBLE CIRCUITS
- 67. QUALITY ASSURANCE OF FLEXIBLE CIRCUITS
- A. SUMMARY OF KEY COMPONENT, MATERIAL, PROCESS, AND DESIGN STANDARDS
- B. GLOSSARY
Tools & Media
Expanded Table of Contents
- A. ABOUT THE EDITOR
- B. LIST OF CONTRIBUTORS
- C. PREFACE
- 1. LEGISLATION AND IMPACT ON PRINTED CIRCUITS
- 2. ELECTRONIC PACKAGING AND HIGH-DENSITY INTERCONNECTIVITY
- 3. SEMICONDUCTOR PACKAGING TECHNOLOGY
- 4. ADVANCED COMPONENT PACKAGING
- 5. TYPES OF PRINTED WIRING BOARDS
- 6. INTRODUCTION TO BASE MATERIALS
- 7. BASE MATERIAL COMPONENTS
- 8. PROPERTIES OF BASE MATERIALS
- 9. BASE MATERIALS PERFORMANCE ISSUES
- 10. THE IMPACT OF LEAD-FREE ASSEMBLY ON BASE MATERIALS
- 11. SELECTING BASE MATERIALS FOR LEAD-FREE ASSEMBLY APPLICATIONS
- INTRODUCTION
- PCB FABRICATION AND ASSEMBLY INTERACTIONS1
- SELECTING THE RIGHT BASE MATERIAL FOR SPECIFIC APPLICATION S2,3
- EXAMPLE APPLICATION OF THIS TOOL
- DISCUSSION OF THE RANGE OF PEAK TEMPERATURES FOR LEAD-FREE ASSEMBLY
- LEAD-FREE APPLICATIONS AND IPC-4101 SPECIFICATION SHEETS
- ADDITIONAL BASE MATERIAL OPTIONS FOR LEAD-FREE APPLICATIONS
- SUMMARY
- REFERENCES
- 12. LAMINATE QUALIFICATION AND TESTING
- 13. PHYSICAL CHARACTERISTICS OF THE PCB
- 14. THE PCB DESIGN PROCESS
- 15. ELECTRICAL AND MECHANICAL DESIGN PARAMETERS
- 16. CURRENT CARRYING CAPACITY IN PRINTED CIRCUITS
- 17. PCB DESIGN FOR THERMAL PERFORMANCE
- 18. INFORMATION FORMATING AND EXCHANGE
- 19. PLANNING FOR DESIGN, FABRICATION, AND ASSEMBLY
- 20. MANUFACTURING INFORMATION, DOCUMENTATION, AND TRANSFER INCLUDING CAM TOOLING FOR FAB AND ASSEMBLY
- 21. EMBEDDED COMPONENTS
- 22. INTRODUCTION TO HIGH-DENSITY INTERCONNECTION (HDI) TECHNOLOGY
- 23. ADVANCED HIGH-DENSITY INTERCONNECTION (HDI) TECHNOLOGIES
- 24. DRILLING PROCESSES
- 25. PRECISION INTERCONNECT DRILLING
- 26. IMAGING
- 27. MULTILAYER MATERIALS AND PROCESSING
- 28. PREPARING BOARDS FOR PLATING
- 29. ELECTROPLATING
- INTRODUCTION
- ELECTROPLATING BASICS
- HIGH-ASPECT RATIO HOLE AND MICROVIA PLATING
- HORIZONTAL ELECTROPLATING
- COPPER ELECTROPLATING GENERAL ISSUES
- ACID COPPER SULFATE SOLUTIONS AND OPERATION
- SOLDER (TIN-LEAD) ELECTROPLATING
- TIN ELECTROPLATING
- NICKEL ELECTROPLATING
- GOLD ELECTROPLATING
- PLATINUM METALS
- SILVER ELECTROPLATING
- LABORATORY PROCESS CONTROL
- ACKNOWLEDGMENT
- REFERENCES
- 30. DIRECT PLATING
- 31. PWB MANUFACTURE USING FULLY ELECTROLESS COPPER
- 32. PRINTED CIRCUIT BOARD SURFACE FINISHES
- INTRODUCTION
- ALTERNATIVE FINISHES
- HOT AIR SOLDER LEVEL (HASL OR HAL)
- ELECTROLESS NICKEL IMMERSION GOLD (ENIG)
- ORGANIC SOLDERABILITY PRESERVATIVE (OSP)
- IMMERSION SILVER
- IMMERSION TIN
- OTHER SURFACE FINISHES
- ASSEMBLY COMPATIBILITY
- RELIABILITY TEST METHODS
- SPECIAL TOPICS
- FAILURE MODES
- COMPARING SURFACE FINISH PROPERTIES
- REFERENCES
- 33. SOLDER MASK
- 34. ETCHING PROCESS AND TECHNOLOGIES
- 35. MACHINING AND ROUTING
- 36. BARE BOARD TEST OBJECTIVES AND DEFINITIONS
- 37. BARE BOARD TEST METHODS
- 38. BARE BOARD TEST EQUIPMENT
- 39. HDI BARE BOARD SPECIAL TESTING METHODS
- 40. ASSEMBLY PROCESSES
- 41. CONFORMAL COATING
- 42. SOLDERABILITY: INCOMING INSPECTION AND WETTING BALANCE TECHNIQUE
- 43. FLUXES AND CLEANING
- 44. SOLDERING FUNDAMENTALS
- 45. SOLDERING MATERIALS AND METALLURGY
- 46. SOLDER FLUXES
- 47. SOLDERING TECHNIQUES
- 48. SOLDERING REPAIR AND REWORK
- 49. PRESS-FIT INTERCONNECTION
- INTRODUCTION
- THE RISE OF PRESS-FIT TECHNOLOGY
- COMPLIANT PIN CONFIGURATIONS
- PRESS-FIT CONSIDERATIONS
- PRESS-FIT PIN MATERIALS
- SURFACE FINISHES AND EFFECTS
- EQUIPMENT
- ASSEMBLY PROCESS
- PRESS ROUTINES
- PWB DESIGN AND BOARD PROCUREMENT TIPS
- PRESS-FIT PROCESS TIPS
- INSPECTION AND TESTING
- SOLDERING AND PRESS-FIT PINS
- REFERENCES
- 50. LAND GRID ARRAY INTERCONNECT
- 51. ACCEPTABILITY AND QUALITY OF FABRICATED BOARDS
- INTRODUCTION
- SPECIFIC QUALITY AND ACCEPTABILITY CRITERIA BY PCB TYPE
- METHODS FOR VERIFICATION OF ACCEPTABILITY
- INSPECTION LOT FORMATION
- INSPECTIONS CATEGORIES
- ACCEPTABILITY AND QUALITY AFTER SIMULATED SOLDER CYCLE(S)
- NONCONFORMING PCBS AND MATERIAL REVIEW BOARD (MRB) FUNCTION
- THE COST OF THE ASSEMBLED PCB
- HOW TO DEVELOP ACCEPTABILITY AND QUALITY CRITERIA
- CLASS OF SERVICE
- INSPECTION CRITERIA
- RELIABILITY INSPECTION USING ACCELERATED ENVIRONMENTAL EXPOSURE
- 52. ACCEPTABILITY OF PRINTED CIRCUIT BOARD ASSEMBLIES
- UNDERSTANDING CUSTOMER REQUIREMENTS
- HANDLING TO PROTECT THE PCBA
- PCBA HARDWARE ACCEPTABILITY CONSIDERATIONS
- COMPONENT INSTALLATION OR PLACEMENT REQUIREMENTS
- COMPONENT AND PCB SOLDERABILITY REQUIREMENTS
- SOLDER-RELATED DEFECTS
- PCBA LAMINATE CONDITION, CLEANLINESS, AND MARKING REQUIREMENTS
- PCBA COATINGS
- SOLDERLESS WRAPPING OF WIRE TO POSTS (WIRE WRAP)
- PCBA MODIFICATIONS
- REFERENCES
- 53. ASSSEMBLY INSPECTION
- INTRODUCTION
- DEFINITION OF DEFECTS, FAULTS, PROCESS INDICATORS, AND POTENTIAL DEFECTS
- REASONS FOR INSPECTION
- LEAD-FREE IMPACT ON INSPECTION
- MINIATURIZATION AND HIGHER COMPLEXITY
- VISUAL INSPECTION
- AUTOMATED INSPECTION
- THREE-DIMENSIONAL AUTOMATED SOLDER PASTE INSPECTION
- PRE-REFLOW AOI
- POST-REFLOW AUTOMATED INSPECTION
- IMPLEMENTATION OF INSPECTION SYSTEMS
- DESIGN IMPLICATIONS OF INSPECTION SYSTEMS
- REFERENCES
- 54. DESIGN FOR TESTING
- 55. LOADED BOARD TESTING
- 56. CONDUCTIVE ANODIC FILAMENT FORMATION
- 57. RELIABILITY OF PRINTED CIRCUIT ASSEMBLIES
- FUNDAMENTALS OF RELIABILITY
- FAILURE MECHANISMS OF PCBs AND THEIR INTERCONNECTS
- INFLUENCE OF DESIGN ON RELIABILITY
- IMPACT OF PCB FABRICATION AND ASSEMBLY ON RELIABILITY
- INFLUENCE OF MATERIALS SELECTION ON RELIABILITY
- BURN-IN, ACCEPTANCE TESTING, AND ACCELERATED RELIABILITY TESTING
- SUMMARY
- REFERENCES
- FURTHER READING
- 58. COMPONENT-TO-PWB RELIABILITY—THE IMPACT OF DESIGN VARIABLES AND LEAD FREE
- 59. COMPONENT-TO-PWB RELIABILITY: ESTIMATING SOLDER JOINT RELIABILITY AND THE IMPACT OF LEAD-FREE SOLDERS
- 60. PROCESS WASTE MINIMIZATION AND TREATMENT
- INTRODUCTION
- REGULATORY COMPLIANCE
- MAJOR SOURCES AND AMOUNTS OF WASTEWATER IN A PRINTED CIRCUIT BOARD FABRICATION FACILITY
- WASTE MINIMIZATION
- POLLUTION PREVENTION TECHNIQUES
- RECYCLING AND RECOVERY TECHNIQUES
- ALTERNATIVE TREATMENTS
- CHEMICAL TREATMENT SYSTEMS
- ADVANTAGES AND DISADVANTAGES OF VARIOUS TREATMENT ALTERNATIVES
- 61. FLEXIBLE CIRCUIT APPLICATIONS AND MATERIALS
- INTRODUCTION TO FLEXIBLE CIRCUITS
- APPLICATIONS OF FLEXIBLE CIRCUITS
- HIGH-DENSITY FLEXIBLE CIRCUITS
- MATERIALS FOR FLEXIBLE CIRCUITS
- SUBSTRATE MATERIAL PROPERTIES
- CONDUCTOR MATERIALS
- COPPER-CLAD LAMINATES
- COVERLAY MATERIALS
- STIFFENER MATERIALS
- ADHESIVE MATERIALS
- RESTRICTION OF HAZARDOUS SUBSTANCES (ROHS) ISSUES
- 62. DESIGN OF FLEXIBLE CIRCUITS
- 63. MANUFACTURING OF FLEXIBLE CIRCUITS
- 64. TERMINATION OF FLEXIBLE CIRCUITS
- 65. MULTILAYER FLEX AND RIGID/FLEX
- 66. SPECIAL CONSTRUCTIONS OF FLEXIBLE CIRCUITS
- 67. QUALITY ASSURANCE OF FLEXIBLE CIRCUITS
- A. SUMMARY OF KEY COMPONENT, MATERIAL, PROCESS, AND DESIGN STANDARDS
- SURFACE MOUNT COUNCIL PUBLICATIONS
- COMPONENTS, GENERAL
- PASSIVE COMPONENTS
- ACTIVE COMPONENTS
- ELECTROMECHANICAL COMPONENTS
- DESIGN ACTIVITIES
- COMPONENT MOUNTING
- SOLDERING AND SOLDERABILITY
- QUALITY ASSESSMENT
- SURFACE-MOUNT PROCESS
- RELIABILITY
- NUMERICAL CONTROL STANDARDS
- TEST METHODS
- REPAIR
- TERMS AND DEFINITIONS
- HOW TO OBTAIN THESE DOCUMENTS
- B. GLOSSARY
Book Details
Title: Printed Circuits Handbook, Sixth Edition
Publisher: : New York, Chicago, San Francisco, Lisbon, London, Madrid, Mexico City, Milan, New Delhi, San Juan, Seoul, Singapore, Sydney, Toronto
Copyright / Pub. Date: 2008 The McGraw-Hill Companies
ISBN: 9780071467346
Authors:
Clyde F. Coombs, Jr.
(Los Altos, CA) recently retired from Hewlett-Packard. He is the editor of all five editions of the Printed Circuits Handbook, the first of which was published in 1967. He is also the editor of two editions of the Electronic Instrument Handbook.
Description: The printed circuit is the basic building block of the electronics hardware industry. It connects virtually all the components used, and affects every employee associated with the product, including design, fabrication, assembly, sourcing, quality, and reliability. There are still very few readily available courses that deal with printed circuits, and, therefore, this handbook remains a major source of information on the subject. Written by a global team of experts from both industry and academia, this new edition of the handbook will deal with both the increasing pressures of High Density Interconnect and the huge government-mandated changes related to lead-free manufacturing.
